141 ?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: june 27, 2011 sp6002 series sp6002 esd and emi filter devices - sp6002 series description applications the littelfuse sp6002 spa series integrates 4 and 6 emi flters (c-r-c) into a small, low-profle udfn package with each flter providing greater than -30db attenuation at 1ghz. additionally, each i/o is capable of shunting 30kv esd strikes (iec61000-4-2, contact discharge) away from sensitive electronic components. the performance of this small, slim design makes it extremely suitable for mobile handsets, pdas and notebook computers. features ? emi fltering of frequencies from 800mhz to 3ghz ? greater than -30db attenuation (typ) at 1ghz ? esd, iec61000-4-2, 30kv contact, 30kv air ? small, low-profle udfn package (typ 0.5mm height) ? keypad interface for portable electronics ? lcd and camera display interfaces for handsets ? connector interfaces for portable electronics ? mobile phone ? smartphone ? portable navigation device pinout 5 8 1 4 1 6 7 12 gnd gnd SP6002-04UTG-1 sp6002-06utg-1 udfn-08 udfn-12 functional block diagram cd cd 18 cd cd 27 cd cd 36 cd cd 45 cd cd 1 12 cd cd 2 11 cd cd 3 10 cd cd 4 9 cd cd 5 8 cd cd 67 SP6002-04UTG-1 sp6002-06utg-1 rohs pb green application example dx: sp6003-04 silicon protection array signa l ground outside world sp6002-04utg (dfn) lcd module controller d1 d2 d3 d4 input 5 8 1 4 gnd sp6002 series 15pf 30kv emi filter array
?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 142 tvs diode arrays (spa ? family of products) revision: june 27, 2011 sp6002 series esd and emi filter devices - sp6002 series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. absolute maximum ratings symbol parameter value units t op operating temperature -40 to 85 c t stor storage temperature -60 to 150 c thermal information parameter rating units storage temperature r ange -65 to 150 c maximum j unction temperature 150 c maximum l ead temperature (soldering 20-40s) 260 c electrical characteristics (t op =25oc) parameter symbol test conditions min typ max units reverse standoff voltage v rwm 6.0 v breakdown voltage v br i r =1ma 7. 0 7. 8 8.5 v reverse leakage current i leak v rwm =5v 0.1 1. 0 a resistance r a i r =10ma 85 100 115 diode capacitance 1,2 c d v r =2.5v,f=1mhz 15 pf line capacitance 1,2 c l v r =2.5v,f=1mhz 24 30 36 pf esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 30 kv iec61000-4-2 (air discharge) 30 kv cutoff frequency 3 f -3db above this frequency, appreciable attenutation occurs 100 mhz notes: 1 parameter is guaranteed by design and/or device characterization. 2 total line capacitance is two times the diode capacitance (c d ). 3 50 source and 50 load termination analog crosstalk (s41) insertion loss (s21) 3.000 000mhz stop 6 000.000.000mhz x2 start 21 log ma g5 db/ ref 0 db 1 _:-613 db ch1 s cor smo 1 st art 3. 000 000 mhz st op 6 000 .000 000 mhz x2 smo cor del ch1 s log mag 10 db/ ref 0 db
143 ?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: june 27, 2011 sp6002 series sp6002 esd and emi filter devices - sp6002 series line capacitance vs. dc bias 0 10 20 30 40 50 60 dc bias (v) capacitance (pf) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 ti me temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zon e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters product characteristics lead plating pre-plated frame lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold fash & metal burr. 4. all specifcations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte fnish vdi 11-13. ordering information part number package size marking min. order qty. SP6002-04UTG-1 udfn-08 1.7x1.35mm kh4 3000 sp6002-06utg-1 udfn-12 2.5x1.35mm kh6 3000 part numbering system part marking system sp 6002 0x u t g -1 series package udfn-08 (1.7x1.35mm) udfn-12 (2.5x1.35mm) t= tape & reel g= green number of channels 04 = 4 channel udfn-08 06 = 6 channel udfn-12 ? silicon protection array (spa tm ) family of tvs diode arrays kh4 kh6 j h x product series k = sp6002 assembly site 4 = udfn-08 6 = udfn-1 2
?2011 littelfuse, inc. specifcations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 144 tvs diode arrays (spa ? family of products) revision: june 27, 2011 sp6002 series esd and emi filter devices - sp6002 series package dimensions udfn-08 udfn-08 millimeters inches min max min max a 0.45 0.55 0.018 0.022 a1 0.00 0.05 0.000 0.002 a3 0.127 ref 0.005 ref b 0.15 0.25 0.006 0.010 d 1.60 1.80 0.063 0.071 d2 1. 10 1.30 0.043 0.051 e 1.25 1.45 0.049 0.057 e2 0.30 0.50 0.012 0.020 e 0.400 bsc 0.016 bsc k 0.20 0.008 0.000 l 0.15 0.35 0.006 0.014 d e a a1 a3 d2 e2 l k b e package dimensions udfn-12 udfn-12 millimeters inches min max min max a 0.45 0.55 0.018 0.022 a1 0.00 0.05 0.000 0.002 a3 0.127 ref 0.005 ref b 0.15 0.25 0.006 0.010 d 2.40 2.60 0.094 0.102 d2 1.90 2.10 0.075 0.083 e 1.25 1.45 0.049 0.057 e2 0.30 0.50 0.012 0.020 e 0.400 bsc 0.016 bsc k 0.20 0.008 0.000 l 0.15 0.35 0.006 0.014 d e a a1 a3 d2 e2 l k b e embossed carrier tape & reel specifcation C udfn-08 p2 d e f t w bo ko ao p d1 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.136 0.140 d1 1. 0 0 - 0.040 - d 1.50 min 0.059 min p 3.90 4.10 0.154 0.161 10p 40.0 +/- 0.20 1.575 +/- 0.008 w 7.70 8.30 0.303 0.327 p2 1.95 2.05 0.077 0.081 a0 1.55 1.75 0.061 0.069 b0 1.90 2.1 0.075 0.083 k0 0.95 1. 15 0.037 0.045 t 0.30 max 0.012 max embossed carrier tape & reel specifcation C udfn-12 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.136 0.140 d1 0.55 0.65 0.021 0.025 d 1.50 min 0.059 min p 3.90 4.10 0.154 0.161 10p 40.0 +/- 0.20 1.575 +/- 0.008 w 7.90 8.30 0.311 0.327 p2 1.95 2.05 0.077 0.081 a0 1.33 1.53 0.052 0.060 b0 2.63 2.83 0.103 0 . 111 k0 0.58 0.78 0.023 0.031 t 0.22 max 0.009 max p2 t bo e f w od / od / p k0 a0
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